Cavendish Kinetics’s Patented Technology Platform

Cavendish Kinetics’s technology represents the third generation of RF MEMS, which historically found success in certain military applications but, because of the expense, large size, high power requirements, and limited lifespan of previous generations of technology, fell short for commercial applications.

CK essentially re-imagined RF MEMS with a fundamentally new approach that fully embeds RF MEMS within an integrated circuit. CK’s patented technology of sub-encapsulation enables MEMS to be built, for the first time, entirely free of contamination.

This breakthrough achievement is possible because CK is able to build its RF MEMS-based products using a monolithic process: i.e., as a single step along with the silicon wafer itself. In the CK technology process the microcavities in which the MEMS are encapsulated are never exposed to air or contaminants.

The result is that CK’s RF MEMS technology yields components with significantly greater reliability – because they eliminate the contamination that was the largest source of failure in previous RF MEMS approaches – and improved performance.

In addition, the monolithic nature of CK’s process means that no special packaging is required for its tunable RF components.